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Technology

Engineering Support

Design Solutions for Customers

Working directly with customer engineering teams ISU is able to provide information on making designs that not only meet perfoamance specifications but also improve manufacturability and quality. Early engagement is the key to discussing your design to determine if there are challenges that may require alternative solutions.

Field Engineer Support

Our team of field application engineers have extensive experience in the PCB industry, which allows them to provide feedback on complex design questions. From material selection, impedance modeling, design rules and capabilities question, they are a valuable resource our customers have come to rely on to make their projects a success.

Prototype and QTA Capability
Our Sylmar facility specializes in quick-turn and lower volume production products. Compressed build times to meet demanding schedules for critical prototypes is a key service we offer. We are then able to use the experience at the prototype stage to successfully ramp the product into production.

Road Map

Facility Capability Summary

Our constant pursuit of improvement empowers us to maintain competitiveness and handle present and future projects with ease.

Manufacturing Capabilities

Backdrill

ISU has developed back drill process technology that utilizes inner layer sensing, which is capable of maintaining reduced back drill stub lengths and tighter tolerances from conventional mechanically controlled depth back drilling.

Sequential Lamination

We manufacture designs that require sequential lamination. There are several different types of sequential lamination designs from HDI build up to mutli-layer sub parts laminated together forming the final structure that can also incorporate micro via technology.

High Aspect Ratio PTH

ISU is capable of producing boards with extremely high aspect ratios. Being able to drill and plate smaller vias enables designs to increase density and improve high speed signal performance. Furthermore, current design trends require more layers on tighter pitch and smaller vias, which we are able to manufacture reliably.

CategoriesBoard DetailsMass productionPrototype
StandardAdvancedStandardAdvanced
SpecificationsLayer Count (Max)44L50L62LAbove 62L
Board Thickness315mil315mil315milAbove 315mil
Aspect Ratio (Thickness/DHS)25:01:0025:01:0030:01:0035:01:00
(200/7.9mil)(200/7.9mil)(175/5.9mil)(175/5.0mil)
Line / Space (Inner 0.5oz)3.0/3.0mil2.75/2.75mil2.75/2.75mil2.5/2.5mil
Line / Space (Outer 0.33oz)3.5/3.5mil3.5/3.5mil3.25/3.25mil3.0/3.0mil
Line / Space (VIPPO 0.33oz+plating)4.0/4.0mil4.0/4.0mil4.0/4.0mil4.0/4.0mil
Registration Budget+/-4.0mil+/-3.5mil+/-3.0mil+/-1.7mil
Drill to Metal (D2M)8.0mil7.0mil6.0mil3.4mil
ControlledInner+/-7%+/- 7% (diff pair ± 5%)+/- 5%+/-5%
ImpedanceOuter+/-10%+/-10%+/-8%+/-8%
Drill (Min DHS)5.9mil5.9mil5.9mil5.0mil
Drill Min CaptureInner (Class3)DHS + 8.0milDHS + 8.0milDHS + 7.5milDHS + 7.0mil
padOuter (Class3)DHS + 8.0milDHS + 8.0milDHS + 7.5milDHS + 7.0mil
BackdrillW/ Sensing4 +/-2.0mil
W/O Sensing6 +/-4.0mil
Min Backdrill diameterDHS+6milDHS+5milDHS+5milDHS+3mil
Min IL Cu edge to Back Drill hole edge5.5mil5.0mil4.5mil1.9mil
Solder maskConventionalPSR-4000BN(Green, Blue, Purple, Red : TAIYO) – Screen
Via FillingPHP900 IR 6P(SANEI, JAPAN) / 92K-2 (SANEI, JAPAN) / CB100 (Conductive)
PTH Via Plugging A/R25:01:0025:01:0030:01:0035:01:00
MicroviasMin uvia drill size4.0mil4.0mil4.0mil4.0mil
LayerMin Capture & Landing padsDHS + 7.0milDHS + 7.0milDHS + 6.5milDHS + 6.0mil
Max Aspect Ratio0.9:11.0:11.0:11.2:1
Max Cu Fill Depth5.0mil
Working Panel Size18 x 24, 21 x 24, 21 x 28, 24 x 30
Core TreatmentOxide, Alternative Oxide(Glicap, low loss)
Surface FinishOSP(Lead Free), ENIG, ENEPIG, Selective Ni/Au + OSP, Selective Ni/Au + ENIG
Immersion Silver, Immersion Tin, HASL, Lead Free HASL
Embedded PassiveBC material (FaradFlex Oak Mitsui MCxxM/MCxxTM/MCXXL) 0.5~1mil

ISU Sylmar – Commonly Used Raw Materials

ManufacturerStd Loss
(Lead Free)
Mid Loss
(Lead Free)
Low Loss
(Lead Free)
Ultra Loss
(Lead Free)
Super Ultra Low Loss
ISOLAFR370HR
185HR
IS410
FR408
FR408HR
IS415
Tachyon100G
Nelco N7000
N4000-29
4000-13(SI)
4000-13 EP(SI)
DoosanDS7402HDS7409DX/DX(C)DS7409DVDS7409DV(N)DS7409DJL2+
DS7409DJN+
Panasonic R1755VMEG4 MEG6
MEG6(G)
MEG7
MEG7(N)MEG8U/N
EMCEM370D
EM828G
EM370Z
EM888
EM891
EM891K
EM888K
EM528
EM890
EM890K
EM892K
HitachiHE679G
HE679GS
TUCTU768
TU862HF
TU872SLK
TU862S
TU883TU883SP
NanyaNPG170N
RogersRogers4000
Embedded Capacitive Material
Oak MitsuiMC24M, MC24P, MC12TM
DuPontHK04, HK04J